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  product structure silicon monolithic integrated circuit this product is not designed for protection against radioactiv e rays . 1/ 14 tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 tsz22111 ? 14 ? 001 www.rohm.com voltage detector ic series for automotive standard cmos voltage detector ic bd48e xx x-m series bd49e xx x-m series general description rohms bd48 e xx x-m and bd49exxx-m series are highly accurate, low current consumption voltage detector ic series. the line up includes bd48xxx devices with n-channel open drain output and bd49xxx devices with cmos output. the devices are available for specific detection voltages ranging from 2.3v to 6.0v in increments of 0.1v. features ? high accuracy detecti on ? ultra-low current consumption ? two output types (n-ch open drain and cmos output) ? wide operating temperature range ? very small and low height package ? package ssop5 is similar to sot- 23 -5(jedec) ? aec -q100 qualified typical application circuit key specifications ? detection voltage: 2.3v to 6.0v (typ.), 0.1v steps ? high accuracy detection voltage: 1.0% ? ultra-low current consumption: 0.9a (typ.) ? operating temperature range: -40c to +105c package ssop5: 2.90mm x 2.80mm x 1.25mm applications circuits using microcontrollers or logic circuits that require a reset for automotive applications (car navigation, car audio, meter panel, exterior lamp etc.) (open drain output type bd48e xxx -m series v dd1 bd48exxx-m v dd2 gnd micro controller r st c l ( capacitor for noi se filtering r l (cmos output type bd49e xxx -m series c l ( capacitor for noise filtering v dd1 bd49exxx-m micro controller r st gnd datashee t downloaded from: http:///
2/ 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 connection diagram ssop5 pin descriptions ssop5 pin no. symbol function 1 v out reset output 2 v dd power supply voltage 3 gnd gnd 4 n.c. unconnected terminal 5 n.c. unconnected terminal ? ordering information lot. no top view v out v dd gnd n.c. n.c. marking part output type reset voltage value package product category packaging and number 48 : open drain 23 : 2.3v g : ssop5 m : automotive category forming specification 49 : cmos 0.1v step tr : embossed tape 60 : 6.0v and reel r e x x x m b d x x - t downloaded from: http:///
3/ 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 lineup output type open drain cmos detection voltage marking part number marking part number 6.0v cm bd48e60 ff bd49e60 5.9v ck bd48e59 fe bd49e59 5.8v ch bd48e58 fd bd49e58 5.7v cg bd48e57 fc bd49e57 5.6v cf bd48e56 fb bd49e56 5.5v ce bd48e55 fa bd49e55 5.4v cd bd48e54 ey bd49e54 5.3v cc bd48e53 er bd49e53 5.2v cb bd48e52 ep bd49e52 5.1v ca bd48e51 en bd49e51 5.0v by bd48e50 em bd49e50 4.9v br bd48e49 ek bd49e49 4.8v bp bd48e48 eh bd49e48 4.7v bn bd48e47 eg bd49e47 4.6v bm bd48e46 ef bd49e46 4.5v bk bd48e45 ee bd49e45 4.4v bh bd48e44 ed bd49e44 4.3v bg bd48e43 ec bd49e43 4.2v bf bd48e42 eb bd49e42 4.1v be bd48e41 ea bd49e41 4.0v bd bd48e40 dy bd49e40 3.9v bc bd48e39 dr bd49e39 3.8v bb bd48e38 dp bd49e38 3.7v ba bd48e37 dn bd49e37 3.6v ay bd48e 36 dm bd49e36 3.5v ar bd48e35 dk bd49e35 3.4v ap bd48e34 dh bd49e34 3.3v an bd48e33 dg bd49e33 3.2v am bd48e32 df bd49e32 3.1v ak bd48e31 de bd49e31 3.0v ah bd48e30 dd bd49e30 2.9v ag bd48e29 dc bd49e29 2.8v af bd48e28 db bd49e28 2.7v ae bd48e27 da bd49e27 2.6v ad bd48e26 cy bd49e26 2.5v ac bd48e25 cr bd49e25 2.4v ab bd48e24 cp bd49e24 2.3v aa bd48e23 cn bd49e23 downloaded from: http:///
4/ 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol limits unit power supply voltage v dd -gnd -0.3 to +10 v output voltage nc h open drain output v out gnd-0.3 to +10 v cmos output gnd-0.3 to v dd +0.3 output current io 70 ma power dissipation ssop5 *1*2 pd 540 mw operating temperature topr -40 to +105 c ambient storage temperature tstg -55 to +125 c *1 reduced by 5.4mw/ c when used over 25c. *2 when mounted on rohm standard circuit board (70mm70mm1.6m m, glass epoxy board). electrical characteristics (unless otherwise specified ta=- 40 c to 105c) parameter symbol condition limit unit min. typ. max. detection voltage v det r l =470k ? , v dd =h ? l *1 v det (t) 0.99 v det (t) v det (t) 1.01 v vdet=2.5v ta=+25c 2.475 2.5 2.525 ta=-40c to 85c 2.418 - 2.584 ta=85c to 105c 2.404 - 2.597 vdet=3.0v ta=+25c 2.970 3.0 3.030 ta=-40c to 85c 2.901 - 3.100 ta=85c to 105c 2.885 - 3.117 vdet=3.3v ta=+25c 3.267 3.3 3.333 ta=-40c to 85c 3.191 - 3.410 ta=85c to 105c 3.173 - 3.428 vdet=4.2v ta=+25c 4.158 4.2 4.242 ta=-40c to 85c 4.061 - 4.341 ta=85c to 105c 4.039 - 4.364 vdet=4.8v ta=+25c 4.752 4.8 4.848 ta=-40c to 85c 4.641 - 4.961 ta=85c to 105c 4.616 - 4.987 output delay time l ? h t plh c l =100pf r =100k ? *2 vout=gnd ? 50% - - 100 s circuit current when on i cc 1 v dd =v det -0.2v *1 v det =2.3-3.1v - 0.51 1.53 a v det =3.2-4.2v - 0.56 1.68 v det =4.3-5.2v - 0.60 1.80 v det =5.3-6.0v - 0.66 1.98 circuit current when off i cc 2 v dd =v det +2.0v *1 v det =2.3-3.1v - 0.75 2.25 a v det =3.2-4.2v - 0.80 2.40 v det =4.3-5.2v - 0.85 2.55 v det =5.3-6.0v - 0.90 2.70 operating voltage range v opl v ol 0.4v, ta=25 to 105 c, r l =470k ? 0.95 - - v v ol 0.4v, ta=- 40 to 25 c, r l =470k ? 1.20 - - v det (t) : standard detection voltage(2.3v to 6.0v, 0.1v step) r l : pull-up resistor to be connected between v out and power supply. c l : capacitor to be connected between v out and gnd. design guarantee. (outgoing inspection is not done on all produ cts.) *1 guarantee is ta=25c. *2 t plh :v dd =(v det typ.-0.5v) ? (v det typ.+0.5v) downloaded from: http:///
5/ 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified ta=- 40 c to 105c ) - continued parameter symbol condition limit unit min. typ. max. lowoutput voltage (nch) v ol v dd =1.5v, i sink = 0.4 ma , v det =2.3-6.0v - - 0.5 v v dd =2.4v, i sink = 2 .0 ma , v det =2.7-6.0v - - 0.5 highoutput voltage (pch) (bd49exxx-m series) v oh v dd =4.8v, i source =0.7 ma , v det (2.3v to 4.2v) vdd-0.5 - - v v dd =6.0v, i source =0.9 ma,v det (4.3v to 5.2v) vdd-0.5 - - v dd =8.0v, i source =1.1 ma,v det (5.3v to 6.0 v) vdd-0.5 - - leak current when off (bd48e xx x-m se ries) i leak v dd =v ds =10v *1 - - 0.1 a detection voltage temperature coefficient v det / ? t ta=- 40 c to 105c (designed guarantee) - 100 360 ppm/c hysteresis voltage ? v det v dd =l ? h ? l, r l =470k ? v det 0.03 v det 0.05 v det 0.08 v v det (t) : standard detection voltage(2.3v to 6.0v, 0.1v step) r l : pull-up resistor to be connected between vout and power supp ly. c l : capacitor to be connected between vout and gnd. design guarantee. (outgoing inspection is not done on all produ cts.) *1 guarantee is ta=25c. downloaded from: http:///
6/ 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 block diagrams fig.1 bd48e xx x-m series fi g.2 bd49exxx-m series v out v dd gnd vref v out v dd gnd vref downloaded from: http:///
7/ 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves fig.3 circuit current 0.0 0.5 1.0 1.5 2.0 0 1 2 3 4 5 6 7 8 9 10 v dd supply voltage v dd [v] circuit current i dd [a] bd4842g/fve 0 5 10 15 20 0.0 0.5 1.0 1.5 2.0 2.5 drain-source voltage v ds [v] "low" output current i ol [ma] bd4842g/fve v dd =2.4v v dd =1.2v fig.4 low output current fig.6 i/o characteristics 0 1 2 3 4 5 6 7 8 9 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 v dd supply voltage v dd [v] output voltage v out [v] bd4842g/fve ta=25 ta=25 0 5 10 15 20 25 30 35 40 45 0 1 2 3 4 5 6 drain-source voltage v ds [v] "high" output current i oh [ma] bd4942g/fve v dd =8.0v v dd =6.0v v dd =4.8v fig.5 high output current bd49e42g-m bd49e42g-m bd48e42g-m bd49e42g-m bd48e42g-m bd49e42g-m bd48e42g-m downloaded from: http:///
8/ 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued fig.7 operating limit voltage [v] 0.0 0.2 0.4 0.6 0.8 1.0 0 0.5 1 1.5 2 2.5 supply voltage: output voltage : v out [v] bd4842g/fve fig.9 circuit current when on 0.0 0.5 1.0 1.5 -40 -20 0 20 40 60 80 100 temperature ta[ ] circu it c urr ent wh en on i dd1 [ a] bd4842g/fve fig.10 circuit current when off 0.0 0.5 1.0 1.5 -40 -20 0 20 40 60 80 100 temperature ta[ ] circu it c urr ent wh en off i dd2 [ a] bd4842g/fve bd48x 42 x bd48x 42 x bd48x 42 x bd49e42g-m bd48e42g-m bd49e42g-m bd48e42g-m bd49e42g-m bd48e42g-m fig.8 detection voltage release voltage 3.0 3.4 3.8 4.2 4.6 5.0 5.4 - 40 0 40 80 temperature : ta[ ] detection voltage : v det [v] bd4842g/fve low to high(v det + v det high to low(v det bd48x 42 x bd49e42g-m bd48e42g-m downloaded from: http:///
9/ 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued fig.11 operating limit voltage 0.0 0.5 1.0 1.5 -40 -20 0 20 40 60 80 100 temperature ta[ ] minimum operation vo l tage v opl [v] bd4842g/fve bd48x 42 x bd49e42g-m bd48e42g-m downloaded from: http:///
10 / 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 application information explanation of operation for both the open drain type (fig.12) and the cmos output type (fig.13), the detection and release voltages are used a s threshold voltages. when the voltage applied to the v dd pins reaches the applicable threshold voltage, the v out terminal voltage switches from either high to low or from low to high. please refer to the timing waveform and electrical characteristics for information on hysteresis. because the bd48 e xx x-m series uses an open drain output type, it is necessary to connect a pull-up resistor to v dd or another power supply if needed [the output high voltage (v out ) in this case becomes v dd or the voltage of the other power supply]. fig.12 (bd48e xx x-m series internal block diagram) fig.13 (bd49e xx x-m series internal block diagram) reference data examples of leading (t plh ) and falling (t phl ) output part number t plh (s) t phl (s) bd48e 45 g-m 39.5 87.8 bd49e 45 g-m 32.4 52.4 v dd =4.3v ? 5.1v v dd =5.1v ? 4.3v *this data is for reference only. the figures will vary with the application, so please confirm actua l operating conditions before use. timing waveform example: the following shows the relationship between the in put voltages v dd and the output voltage v out when the input power supply voltage v dd is made to sweep up and sweep down (the circuits are those in fig.1 2 and 13). 1 when the power supply is turned on, the output is unst able from after over the operating limit voltage (v opl ) until t phl . therefore it is possible that the reset signal is not vali d when the rise time of v dd is faster than t phl . 2 when v dd is greater than v opl , but less than the reset release voltage (v det + ? v det ), the output voltages will switch to low. 3 if v dd exceeds the reset release voltage (v det + ? v det ), then, v out switches from l to h. 4 if v dd drops below the detection voltage (v det ) when the power supply is powered down or when there is a power supply fluctuation, v out switches to l (with a delay of t phl ). 5 the potential difference between the detection voltage and the release voltage is known as the hysteresis width (?v det ). the system is designed such that the output does not toggle with power supply fluctuations within this hysteresis width, preventi ng the malfunctions due to noise. v dd v det + v det v det v opl 0v t phl v out t plh t phl t plh v ol v oh fig.14 timing waveform vref r1 r2 v dd gnd q1 v out r3 r l vref r1 r2 r3 q2 q1 v dd v out gnd downloaded from: http:///
11 / 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 circuit applications 1) examples of a common power supply detection reset circuit. application examples of bd48e xx x-m series (open drain output type) and bd49e xx x-m series (cmos output type) are shown on the left. case1: power supply of the microcontroller (v dd2 ) differs from the power supply of the reset detection (v dd1 ). use an open drain output type (bd48xxx-m) device with a load resistance r l attached as shown in figure 15. case2: power supply of the microcontroller (v dd1 ) is same as the power supply of the reset detection (v dd1 ). use a cmos output type (bd49xxx-m) device or an open drain device with a pull up resistor between output and vdd1. when a capacitance c l for noise filtering is connected to the v out pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (v out ). the electrical characteristics were measured using r l = 470k ? and c l = 100 pf . 2) the following is an example of a circuit application in which an or connection between two types of detection voltag e resets the microcontroller. to reset the microcontroller when many independent powe r supplies are used in the system, or connect an open d rain output type (bd48exxx-m series) to the microcontrollers input with pull -up resistor to the supply voltage of the microcontroller (v dd3 ) as shown in fig. 17. by pulling-up to v dd3 , output high voltage of micro-controller power supply is possible. fig.16 cmos output type v dd1 bd48e xx x-m v dd2 gnd micro controller r st c l ( capacitor is for noise filtering r l c l ( capacitor is for filtering v dd1 bd49exxx-m micro controller r st gnd fig.15 open drain output type v dd2 v dd1 v dd3 gnd microcontroller r l bd48e xxx -m bd48exxx-m r st fig.17 downloaded from: http:///
12 / 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 3) examples of the power supply with resistor dividers in applications wherein the power supply voltage of an ic co mes from a resistor divider circuit, an in-rush current will flow into the circuit when the out put level switches from high to low or vice versa. in -rush current is a sudden surge of current that flows from the power supply (vdd) to ground (gnd) as the output logic changes its state. this current flow may cause malfunction in the systems operation such as output oscillations, etc. fig.18 when an in-rush current (i1) flows into the circuit (refer to fig. 18 ) at the time when output switches from low to high, a voltage drop of i1r2 (input resistor) will occur in the circuit causing the vdd supply voltage to decrease. when the vdd voltage drops below the detection voltage, the output will switch from high to low. while the output voltage is at low condition, in-rush current will stop flowing and the voltage drop will be reduced. as a result, the output voltage will swit ches again from low to high which causes an in -rush current and a voltage drop. this operation repeats and will result to oscillation. v out r2 v dd bd48exxx-m bd49exxx-m gnd r1 i1 v1 cin c l i dd v dd v det 0 through current fig.19 current consumption vs. power supply voltage downloaded from: http:///
13 / 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings operating the ic over the absolute maximum ratings may da mage the ic. the damage can either be a short circuit between pins or an open circuit between pins. therefore, it is important to consider circuit protection measures, s uch as adding a fuse, in case the ic is operated over the absolute m aximum ratings. 2) ground voltage the voltage of the ground pin must be the lowest voltage o f all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the co nditions of each parameter. 4) bypass capacitor for noise rejection to help reject noise, put a 1f capacitor between v dd pin and gnd and 1000pf capacitor between v out pin and gnd. be careful when using extremely big capacitor as transient respons e will be affected. 5) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mou nted in a wrong orientation or if pins are shorted together . s hort circuit may be caused by conductive particles caught betwe en the pins. 6) operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic fie ld may cause the ic to malfunction. 7) the v dd line impedance might cause oscillation because of the dete ction current. 8) a v dd to gnd capacitor (as close connection as possible) should be used in high v dd line impedance condition. 9) lower than the mininum input voltage puts the v out in high impedance state, and it must be v dd in pull up (v dd ) condition. 10) external parameters the recommended parameter range for r l is 1 0k to 1m. there are many factors (board layout, etc) that ca n affect characteristics. please verify and confirm using practical appl ications. 11) power on reset operation please note that the power on reset output varies with the v dd rise time. please verify the behavior in the actual operation. 12) testing on application boards when testing the ic on an application board, connecting a c apacitor directly to a low-impedance output pin may sub ject th e ic to stress. always discharge capacitors completely afte r each process or step. the ics power supply should always be turned off completely before connecting or remov ing it from the test setup during the inspection process. t o prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transpo rt and storage. 13) rush current when power is first supplied to the ic, rush current may flow instantaneously. it is possible that the charge current to the parasitic capacitance of internal photo diode or the internal logic may be unstable. therefore, give special consideration to power coupling capacitance, power wiring, width of gnd wiring, and routing of connections. 14) this ic has extremely high impedance terminals. small lea k current due to the uncleanness of pcb surface might cause unexpected operations. application values in these conditions should be selected carefully. if 10m? leakage is assumed between the c t terminal and the gnd terminal, 1m? connection between the ct terminal and the v dd terminal would be recommended. also, if the leakage is assumed between the vout terminal and the gnd terminal, the pull up resistor should be less than 1/10 of the assumed lea k resistance. downloaded from: http:///
14 / 14 bd48exxx- m series bd49exxx- m series tsz02201-0r7r0g300070-1-2 ? 20 13 rohm co., ltd. all rights reserved. 27.aug.2013 rev.004 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 30 .mar.2012 001 new release 14.dec.2012 002 updated general description , features, applications , absolute maximum ratings , explanation of operation , timing waveform , circuit applications, and operational notes. changed lineup table format. add io in absolute maximum rating table add limits for vdet specifically at vdet=2.5v,3.0v,3.3v,4.2v,4.8v change parameter in electrical characteristics from iol to vol and i oh to voh add circuits application numbers 2 and 3 added revision history. 22 . ma y.2013 00 3 change limits for vdet at vdet=2.5v,3.0v,3.3v,4.2v,4.8v 27.aug.2013 004 update the applications and features on page 1 and ordering info rmation on page 2 downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class  class  class  b class  class | class  2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///


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